![]() ![]() ![]() The USB 3.0 specification defined a new architecture and protocol, named SuperSpeed, which included a new lane for a new signal coding scheme (8b/10b symbols, 5 Gbps also known later as Gen 1) providing full-duplex data transfers that physically required five additional wires and pins, while preserving the USB 2.0-architecture and -protocols and therefore keeping the original 4 pins/wires for the USB 2.0 backward-compatibility resulting in 9 wires (with 9 or 10 pins at connector interfaces ID-pin is not wired) in total. USB 3.0, released in November 2008, is the third major version of the Universal Serial Bus (USB) standard for interfacing computers and electronic devices. ![]() USB 3.0 Promoter Group ( Hewlett-Packard, Intel, Microsoft, NEC, ST-Ericsson, and Texas Instruments) ![]()
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